Common components: resistance, capacitors, potentiometers, electronic tubes, inductors, radiator, connectors, electroacoustic devices, laser devices, electronic display devices, photoelectric devices, sensors, power supply, switches, relays, printed circuit boards, integrated circuits, crystal, quartz, ceramic magnetic materials, printed circuit with substrate, substrate electronic function process special materials, etc.

Temperature service range: -55℃ ~ 175℃

The cause of the heating of the electronic components

1. Internal resistance generates heat energy

In the process of electronic components, there will be some current through the conductor and resistance devices, the current through these components will produce some resistance, this part of the electric energy is converted into heat energy, resulting in the increase in the temperature of the components.

2. Energy failure

In the working process of electronic components, some energy failure may occur, such as the power dissipation of capacitors and insulation materials causing current leakage. This loss of energy is also converted into heat energy, causing the components to heat.

3. Environmental impact

Ambient temperature and ventilation conditions can also influence the temperature of the electronic components. If the ambient temperature is high or the ventilation conditions are poor, the temperature of the components increases, resulting with more heat production.

Factors of heating in electronic components

1. Power size of the components:

The greater is the power of the components, the more serious the heating is. Therefore, when designing the circuit, it is necessary to control the power size of the components as far as possible, in order to reduce the impact of its heating on the circuit and operation.

2. Component quality:

The quality of the components is different, and the materials and processes used are also different, so the heating situation is also different. Good quality components, in the process of working heating will be relatively small, so the need to choose high quality components.

3. Ambient temperature and ventilation conditions:

Ambient temperature and ventilation conditions will also affect the heating of the components. When the temperature is too high or the ventilation is poor, the heating of components will be more serious, so it is necessary to choose a good environment to work.

Cooling-down method:

Natural heat dissipation or cooling: temperature control through the heat dissipation of the surrounding environment

1. Air cooling: the principle of the method is to accelerate the air flow around the electronic components through the external driving force, such as the blower and fan, so that the air produces forced convection, improve the heat transfer efficiency, and take away the heat.

2. Hydrocooling:

 Direct: the liquid in direct contact with the related electronic components, absorb heat through the coolant and take away heat, mainly in some relatively high heat consumption volume density or applied in high temperature environment devices.

Indirect: through the intermediate medium system, the liquid module, the thermal guide module, and the liquid guide module and the liquid substrate.